Method and apparatus for notching a lead wire attached to an IC chip to facilitate severing the wire
US5067382A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1990 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Nov 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9444
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for notching a wire so that it can be severed at the notched location by applying an axial force thereto. The apparatus includes a linearly reciprocal mechanism adapted to move forwardly, placing a pair of cutting blades in straddling relationship with the wire and includes an actuating mechanism for laterally reciprocating the cutting blades to form notches in opposite sides of the wire before retracting the cutting blades from the straddling relationship with the wire. The method of the invention includes the steps of moving a pair of cutting blades into straddling relationship with a wire, reciprocally moving the cutting blades into and out of cutting engagement with the wire and subsequently retracting the cutting blades from the straddling relationship with the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.