Method of inserting medical devices incorporating SIM alloy elements
US5067957A · kind A · utility
832Cited by
45References
41Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 1988 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Sep 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S606/911
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Medical devices which are currently proposed to use elements made from shape memory alloys may be improved by the use of stress-induced martensite alloy elements instead. The use of stress-induced martensite decreases the temperature sensitivity of the devices, thereby making them easier to install and/or remove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.