Semiconductor device encapsulant consisting of epoxy resin composition
US5068267A · kind A · utility
12Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1989 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Sep 12, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains PA1 (a) an epoxy resin, PA1 (b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin, PA1 (c) a curing accelerator, and PA1 (d) a silica powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.