Electroslag surfacing
US5068507A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 31, 1991 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Jan 31, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C26/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for electroslag surfacing of metal plate which utilizes a plate feeder assembly to which the plate is presented and which includes an elongate, horizontally disposed feeder table having an approach-end section and a runout-end section. The plate, with a major surface uppermost, is conveyed along the feeder table in a feeding direction from said approach-end section to said runout-end section, and is subjected to an electroslag operation at a surfacing installation located intermediate those sections to provide a cladding metal layer on that surface. At the surfacing installation, there is a flux mould arrangement under an electrode holder and feeder assembly having depending electrodes vertically in line with the interior of the mould arrangement. The plate is passed under the mould arrangement and the electrode holder and feeder assembly is vertically adjusted to bring a lower end of the electrode means into contact with the upper surface and to establish current flow. On establishing current flow, the electrodes then are raised to establishing an arc between the electrodes and the uppermost surface, with charging or flux to mould arrangement establishing a …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.