Semiconductor laser apparatus
US5068866A · kind A · utility
12Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1989 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Oct 30, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser chip is directly disposed on a support member through a mounting arrangement and a support member, the laser chip, and peripheral parts thereof are integrally sealed within a transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.