Plated plastic castellated interconnect for electrical components
US5069626A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1990 |
| Grant date | Dec 3, 1991 |
| Priority date | — |
| Expiry date | Aug 20, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plated plastic castellated interconnect comprises a substrate made from a molded polymeric material and having top and bottom surfaces with a plurality of separate mutually spaced apart castellations integrally molded to the substrate and projecting from the bottom surface of the substrate. A plurality of separate spaced apart recessed regions may be molded in an edge of the substrate and aligned with the castellations. A plurality of metal conductors are plated to the substrate as separate conductive circuit traces, so that each circuit trace extends continuously from the top surface, along the surface of a corresponding recess and to a common plane on a respective castellation at the bottom of the substrate. The plated metal castellations are arranged for soldering or gluing to contacts on a printed circuit board for electrical connection to an electrical component such as an IC chip connected to the circuit traces on the substrate. The plated plastic castellations on one component provide high lead pitch densities, complex configurations, and compliancy of electrical connections to a second electrical component, as well as other advantages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.