Patent · US Expired

Radiation sensitive mixture and production of relief patterns

US5069998A · kind A · utility

10Cited by

7References

8Claims

0Family size

Assignee

BASF SE

Inventors

Reinhold Schwalm · Monsheim, DE
Andreas Boettcher · Leimen, DE
Martin Fischer · Ludwigshafen, DE
Horst Binder · Lampertheim, DE

Key dates

Filing date	May 16, 1989
Grant date	Dec 3, 1991
Priority date	—
Expiry date	May 16, 2009

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/122
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A radiation sensitive mixture useful for producing relief patterns contains PA0 (a) a polymeric binder which is insoluble in water but soluble in aqueous alkaline solutions and PA0 (b) an organic compound whose solubility in an aqueous alkaline developer is increased by the action of acid and which contains at least one acid cleavable group and additionally a group which forms a strong acid on irradiation, and in addition PA0 (c) a nonphotosensitive organic compound which contains at least one acid cleavable bond and the solubility of which in an aqueous alkaline developer is increased by the action of acid, or PA0 (d) a nonphotosensitive organic compound which contains at least one acid cleavable bond and which by the action of acid decomposes in such a way as to be completely removable by treatment at from 60.degree. to 120.degree. C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.