Process of making a ferroelectric electronic component and product
US5070026A · kind A · utility
95Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1989 |
| Grant date | Dec 3, 1991 |
| Priority date | — |
| Expiry date | Jun 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B53/00
Abstract
An improved process of making a ferroelectric electronic component, such as a non-volatile RAM or an electro-optic switching array, is disclosed. The process essentially includes the separate formation of two subassemblies and then connecting them by placing one on top of the other. Electrical contacts are made by "bumping" or other "flip chip" techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.