Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
US5070039A · kind A · utility
206Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1989 |
| Grant date | Dec 3, 1991 |
| Priority date | — |
| Expiry date | Apr 13, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead from 10 carries an integrated circuit on a die support pad 14. The lead frame has a dam bar including a transverse portion that extends between adjacent leads (20) for limiting mold flash. The dam bar transverse portion 26 is entirely severed from the adjacent leads for final removal by a metal punch 33 along with the supporting web 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.