Solvent-free, low-monomer or monomer-free polymerizable hot melt composition

US5070121A · kind A · utility

Assignee

• Schmalbach-Lubeca AG · DE

Inventors

• Rudolf Hinterwaldner · Munich, DE
• Georg Bolte · Vechelde, DE

Key dates

• Filing date: Apr 25, 1989
• Grant date: Dec 3, 1991
• Expiry date: Apr 25, 2009

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09D157/10
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention concerns a solvent-free, polymerizing hotmelt substance free of, or low in monomers, for corrosion- and/or abrasion proofing and/or forming a protective film with barrier properties on a real substrates and molded bodies made of metal, plastic, cellulose materials and/or inorganic materials, in particular for wrapping purposes, and consisting of PA1 (a) one or more polymerizing polymers containing hydroxyls with an average molecular weight (M.sub.w) between 1,000 and 500,000 and with a glass transition temperature (T.sub.g).gtoreq.20.degree. C., and/or PA1 (b) one or more polymerizing, linear, unbranched and/or unbranched polyesters and/or their copolymers with an average molecular weight (M.sub.w) between 900 and 50,000 and with a glass transition temperature (T.sub.g).gtoreq.-50.degree. C., and/or PA1 (c) a polymerizing oligomer bearing ethylene-unsaturated groups of acryl-, methacryl-, ether-, ester-, urethane-, amide-, imide-, epoxy-, siloxane-, phenol-, novolak- and/or mercapto-compounds with an average molecular weight (M.sub.w) between 400 and 10,000, and PA1 (d) where called further known additives, which is characterized by containing such components (a), (b)…