Apparatus for applying dielectric or metallic materials
US5070811A · kind A · utility
Inventors
Key dates
| Filing date | Nov 14, 1988 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Nov 14, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/32
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an apparatus for applying dielectric or metallic substances, such as silicon dioxide, for example, to a substrate (15) disposed in a vacuum chamber (16, 17), the apparatus having an electron emitter (9) and having solenoid coils (30, 42) disposed in the area of the vacuum chamber, the electron emitter (9) is disposed in a separate generator chamber (37) forming the anode (11) and communicating with the vacuum chamber (17), so that, after the process gas is introduced into the generator chamber (37) a large-area plasma jet (8) is produced which is guided by the action of magnets (6, 20, 30, 42) between the electron emitter (9) and a melting furnace (7) disposed in the vacuum chamber (17), while the vapor stream issuing from the melting furnace (7) is accelerated and reaches the substrate (15) as activated vapor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.