Apparatus for processing a molded carrier ring device
US5070916A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1990 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Jun 11, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8834
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided for receiving a molded carrier ring package and removing the electronic component from the surrounding ring while cutting and forming the leads of the component. The shear provides that leads on two opposite sides of a rectangulopiped component are cut just prior to the leads extending from the remaining two sides, during one stroke of the shear, such that the applied force required to cut all of the leads is reduced by acting on one-half of the leads at a time, and such that the applied forces are balanced on opposite sides of the component. Each of a punch and die is easily interchanged with a replacement, and a scrap remover is continuously adjustable during closing of the jaws thereof, so that it is a simple matter to change the tooling and otherwise accommodate devices of different sizes. Also, the apparatus provides for diverting the forces of the shearing and forming action from a shuttle for transporting the device so as to minimize wear and tear on it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.