Circuit structure formed by insert molding of electric and/or optical transmission medium
US5071223A · kind A · utility
11Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1990 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Jun 14, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A unitary circuit structure has an electric and/or optical transmission medium. The structure includes at least one of an optical signal transmission medium (22), an electric signal transmission medium (1, 8, 21, 41), and an electric power transmission medium (23) which are insert-molded in a plastic which forms a housing (7, 24) for electronic and electric devices and parts. The circuit structure serves as both conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.