Method for photoresist stripping using reverse flow
US5071485A · kind A · utility
77Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1990 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Sep 11, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.