Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
US5071701A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1989 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Nov 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3463
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e.g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane-substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.