Thermoplastic hot melt adhesive containing epoxy adduct
US5071914A · kind A · utility
26Cited by
32References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1989 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Aug 17, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/813
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.