Thermoplastic molding materials based on polyamide blends

US5071924A · kind A · utility

Assignee

• BASF SE

Inventors

• Eckhard M. Koch
• Gerhard Heinz · Bad Dürkheim, DE
• Walter Goetz · Ludwigshafen, DE
• Gunter Pipper · Bad Dürkheim, DE

Key dates

• Filing date: Jul 7, 1989
• Grant date: Dec 10, 1991
• Expiry date: Jul 7, 2009

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA0 A) 20-98% by weight of a partly aromatic amide copolymer essentially consisting of PA0 a.sub.1) 40-90% by weight of units derived from terephthalic acid and hexamethylenediamine, PA0 a.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam and PA0 a.sub.3) 0-60% by weight of units derived from adipic acid and hexamethylenediamine, components a.sub.2) and/or a.sub.3) accounting altogether for not less than 10% by weight of the total number of units, PA0 B) 2-80% by weight of a partly crystalline thermoplastic polyamide which differs from A) and furthermore PA0 C) 0-50% by weight of an elastomeric impact modifier and PA0 D) 0-60% by weight of fibrous or particulate fillers or a mixture of these.