Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
US5072289A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1989 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Nov 8, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0979
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed. PA1 The wiring substrate comprises: PA0 a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support; PA0 at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support; PA0 a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; and PA0 a bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.