Method of making molds for electrodeposition forming of microstructured bodies

US5073237A · kind A · utility

Assignee

• Kernforschungszentrum Karlsruhe GmbH · DE

Inventors

• Walter Bacher · Blankenloch, DE
• Hans Biedermann · Bruchsal, DE
• Michael Harmening · Hirschberg, DE

Key dates

• Filing date: Mar 20, 1991
• Grant date: Dec 17, 1991
• Expiry date: Mar 20, 2011

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29C2059/023
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold. The microstructured negative mold is then ready for electrodeposition of a metal in the microstructure recesses using the electrically conductive film therein as an electrode.