Method for housing a tape-bonded electronic device and the package employed
US5073521A · kind A · utility
63Cited by
24References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 15, 1989 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | Nov 15, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the assembly of an adhesively sealed tape package having base and cover components is provided. An electronic device is first bonded to the inner leads of a tape leadframe. The chip on tape is then disposed between the base component and the cover component and adhesively sealed to both. The electronic device and a portion of the inner leads are thereby encapsulated. In one embodiment the base and cover components are an aluminum base alloy having an anodization layer over at least those surfaces exposed to the external environment of the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.