Themoplastic resin composition and process for producing the same
US5073590A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 1991 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | May 7, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition is obtained by blending 100 parts by weight of a resin blend consisting of 10 to 90% by weight of at least one polypropylene type resin (A) selected from the group consisting of modified polypropylenes and compounds composed of modified polypropylenes and polypropylenes, and 90 to 10% by weight of a polyamide resin (B); 2 to 30 parts by weight of an epoxy group containing copolymer (C) and 2 to 100 parts by weight of an ethylene-.alpha..beta.-unsaturated carboxylic acid alkyl estermaleic anhydride terpolymer (D). The composition can easily be processed into a molded product, a film, a sheet or the like by a conventional processing method such as injection molding and extrusion molding. The resulting product has a very good balance in physical properties such as heat resistance, coating properties, impact strength and flexural modulus. The composition of this invention is useful in the fields of automobiles, electric industry and electronic industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.