Modified polypropylene power suspended in film-forming resin
US5073594A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 1990 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | Jan 29, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2323/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Primer compositions are disclosed which are a homogeneous, fluid, uncured suspension of discrete particles of a polar group-containing modified propylene polymer (MPP) in a film forming resin material, the particles having an average particle size of less than about 5 microns, and the primer composition being substantially free, i.e., containing less than about 5%, of a solvent for the MPP based upon the weight of said MPP. The preferred MPP is maleic anhydride polypropylene. The preferred film forming resin material is an epoxy resin. The particles of MPP are present in the primer in an amount of at least about 3%, preferably at least 40%, by weight based on the weight of the nonvolatile content of the primer. A free flowing powder adapted to be suspended in the primer composition is also disclosed which not only has an average particle size as above stated but comprises about 25% to about 45% by weight of discrete particles of a MPP and about 55% to about 75% by weight of a liquid which is a solvent for the film forming resin material of the primer, all percentages by weight being based on the total weight of the powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.