Multi-sublayer dielectric layers
US5073814A · kind A · utility
106Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1990 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | Jul 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dielectric layer comprising a plurality of sublayers of alternating composition can provide a reduced dielectric constant while providing the adhesion and laser drilling properties of a higher dielectric constant material. Such multi-sublayer dielectric layers may be formed in situ on a high density interconnect structure or may be laminated thereon after their own formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.