Solder flux dispenser suitable for use in automated manufacturing
US5074455A · kind A · utility
12Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1990 |
| Grant date | Dec 24, 1991 |
| Priority date | — |
| Expiry date | Oct 9, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dispenser (100) for solder flux includes a first solder flux reservoir (110) with a dispensing tip (118) at one end thereof for dispensing solder flux (112) in response to a frictional pressure applied to the tip. A second solder flux reservoir (102) is also included having a dispensing channel (106) for dispensing solder flux (104) responsive to a pressure applied to the flux (104) within the second solder flux reservoir (102).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.