Patent · US Expired

High permeability heat pipe wick structure

US5076352A · kind A · utility

44Cited by
10References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 8, 1991
Grant dateDec 31, 1991
Priority date
Expiry dateFeb 8, 2011

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28D15/046
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A high permeability wick structure for heat pipes. A thin capillary liquid transport structure is encased within relatively thick sections of a plastic bonded aluminum powder wick. The capillary structure is formed of two layers of fine mesh screen separated only by small, randomly located, powdered metal granules. The capillary liquid transport structure can be built in numerous cross sectional configurations, including annular rings or spoke like radial sections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.