Electrophoretic deposition apparatus
US5076905A · kind A · utility
1Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 1990 |
| Grant date | Dec 31, 1991 |
| Priority date | — |
| Expiry date | Jun 28, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
It has hitherto been difficult to achieve the even deposition of a cup-shaped body from slurry flowing around a mandrel. This specification discloses a deposition apparatus including control means providing a substantially uniform slurry flow rate over all surfaces of the mandrel to give uniform deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.