Epoxy resin/imidazole/polyphenol adduct as epoxy curing agent
US5077355A · kind A · utility
10Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1990 |
| Grant date | Dec 31, 1991 |
| Priority date | — |
| Expiry date | Feb 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/934
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A powder coating composition is disclosed which includes an epoxy resin which is solid at room temperature, and a curing agent, characterized in that the curing agent includes an adduct obtained by reaction of (a) a polyfunctional epoxy resin, (b) an imidazole compound having a secondary amino group in the imidazole ring thereof and (c) a polyhydric phenol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.