Method and apparatus for pressure sticking a thin film to a base plate
US5078820A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 24, 1989 |
| Grant date | Jan 7, 1992 |
| Priority date | — |
| Expiry date | Mar 24, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1734
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and method for pressure and heat sticking a thin film to a base plate. The thin film and a base plate on a film like carrier are introduced into a vacuum chamber having upper and lower contact members for compressing the thin film, base member and carrier into a stratified body. The thin film and base plate are held separate from one another in the chamber. The lower contact member moves upward to contact the carrier and base plate and to compress the stratified body between it and the upper contact member. The upper contact member is convex in shape and made of an elastic material so that the contact pressure on the thin film and base plate starts near the center and spreads toward the periphery resulting in improved sticking of thin film to the base plate with no air bubbles and no wrinkling. The pressure is applied in a vacuum or reduced atmospheric pressure and heat is simultaneously applied. A further compression in the air at atmospheric pressure is carried out by a heat and pressure roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.