Formaldehyde containing resins having a low free formaldehyde
US5079067A · kind A · utility
11Cited by
9References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 1991 |
| Grant date | Jan 7, 1992 |
| Priority date | — |
| Expiry date | Mar 11, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24727
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Formaldehyde containing resins used as curing, setting or crosslinking resins in a variety of natural product adhesives can be made with surprisingly low and novel levels of free formaldehyde, can be made using reactants that can remove free formaldehyde from the resin solution or from the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.