Article comprising metal substrates bonded with reactive hot melt structural adhesive and process thereof
US5079094A · kind A · utility
7Cited by
1References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 1990 |
| Grant date | Jan 7, 1992 |
| Priority date | — |
| Expiry date | Aug 8, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.