Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane
US5079331A · kind A · utility
3Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1990 |
| Grant date | Jan 7, 1992 |
| Priority date | — |
| Expiry date | May 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/3415
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.