Resin composition
US5081187A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1990 |
| Grant date | Jan 14, 1992 |
| Priority date | — |
| Expiry date | Mar 16, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition which shows excellent balance in mechanical strengths and has superior solvent resistance and processability. This composition comprises: PA0 (a) a polyolefin resin in an amount of 20-95% by weight, PA0 (b) a polyphenylene ether resin in an amount of 80-5% by weight, PA0 (c) a partially hydrogenated alkenyl aromatic compound-isoprene block copolymer in an amount of 2-45 parts by weight based on totally 100 parts by weight of the components (a) and (b), and PA0 (d) an alkenyl aromatic compound-conjugated diene block copolymer in an amount of 3-45 parts by weight based on totally 100 parts by weight of the components (a) and (b). This composition can be easily molded into articles very excellent in balance of impact strength, heat resistance and solvent resistance and having uniform and smooth surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.