Patent · US Expired

Method for soldering components onto printed circuit boards

US5081336A · kind A · utility

10Cited by

8References

13Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Rudolf Schuster · Heimstetten, DE
Josef Raschke · Pliening, DE
Hermann Bloessl · Munich, DE

Key dates

Filing date	Sep 25, 1990
Grant date	Jan 14, 1992
Priority date	—
Expiry date	Sep 25, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method wherein the component to be soldered is placed onto the printed circuit board, whereupon the stirrup electrodes of the soldering mechanism are lowered and the terminal legs of the component are pressed against the printed circuit board with a force. After heating the stirrup electrodes for melting the solder, a further advance of the stirrup electrodes ensues for impressing the terminal legs into the molten solder. The formation of a solder layer between terminal legs and printed circuit board subsequently ensues by reducing the force exerted onto the stirrup electrodes and/or by defined retraction of the stirrup electrodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.