Chip mounting substrate having an integral molded projection and conductive pattern
US5081520A · kind A · utility
187Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1990 |
| Grant date | Jan 14, 1992 |
| Priority date | — |
| Expiry date | May 16, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an improved chip mounting method for mounting an IC chip on a substrate, comprising the steps of; integrally molding a projection on the substrate, the projection being located on a surface of the substrate on which the IC chip will be mounted; forming a conductive pattern on the projection and on a necessary portion of the substrate; forming a connecting layer on the conductive pattern formed on the projection; and fixing said IC chip on the substrate while electrically connecting an exposed electrode of the IC chip with the conductive pattern formed on the projection through the connecting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.