Method of soldering honeycomb body
US5082167A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 17, 1990 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | Sep 17, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.