Resin composition of high storage stability
US5082598A · kind A · utility
2Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1989 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | May 8, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/923
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition of highly satisfactory storage stability comprises 100 parts by weight of a thermosetting resin composition, 0.0001 to 2.0 parts by weight of a thiuram compound possessing at least one atomic group represented by the following formula: ##STR1## wherein p stands for an integer in the range of 1 to 8, and 0.00001 to 0.1 part by weight (as copper metal) of a copper-containing compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.