Resin composition and multilayered structure
US5082743A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1990 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | Sep 21, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are resin compositions comprising: PA0 (A) 60 to 95% by weight of an ethylene-vinyl acetate copolymer having an ethylene content of 20 to 65 mol % and a saponification degree of vinyl acetate component of at least 96%, PA0 (B) 4.5 to 39.5% by weight of an ethylene-vinyl acetate copolymer having an ethylene content of 60 to 98 mol %, and PA0 (C) at least 0.5% by weight of a saponified product of an ethylene-vinyl acetate copolymer having an ethylene content of 68 to 98 mol % and a saponification degree of vinyl acetate component of at least 20%, the incorporation ratio of (C) based on the sum of (B) and PA0 (C) being not more than 38% by weight. The resin compositions of the present invention have markedly improved flexibility without deteriorating transparency and gas barrier properties as compared with conventional saponified products of ethylene-vinyl acetate copolymers. Multilayered structures comprising at least one layer of the composition have excellent resistance to falling shock, flexural resistance, prevention of air-back, skin-pack adaptability and shrink-packaging capability and can hence of great value for packaging various goods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.