Polypropylene resin composition having high dielectric strength
US5082888A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1989 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | Oct 3, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/34
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polypropylene resin composition having high dielectric strength comprising: PA0 A) from about 50% to about 80% by weight of a crystalline ethylene-propylene block copolymer having a melt flow index (MI) at 230.degree. C. of not less than about 3 g/10 min and an ethylene content of not less than about 4% by weight; PA0 B) from about 15% to about 30% by weight of mica having an average particle size of from about 15 to about 50 microns and the following particle size distribution: PA1 .gtoreq.30 microns from about 10% to about 80% by weight PA1 .gtoreq.20 microns from about 30% to about 95% by weight PA1 .gtoreq.10 microns not less than about 60% by weight PA1 .gtoreq.5 microns not less than about 80% by weight PA0 C) from about 5% to about 20% by weight of talc having an average particle size of from about 15 to about 40 microns and the following particle size distribution: PA1 .gtoreq.30 microns from about 20% to about 65% by weight PA1 .gtoreq.20 microns from about 40% to about 80% by weight PA1 .gtoreq.10 microns from about 65% to about 95% by weight PA1 .gtoreq.5 microns not less than about 85% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.