Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5083194A · kind A · utility
102Cited by
24References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 16, 1990 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | Jan 16, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/182
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An air-jet impingement cooling method combined with a miniature pin-fin heat sink provides equivalent fluid flow to each IC package in a module and achieves a high heat transfer rate per volume. The packaging design is comparable to high-density packaging systems utilizing low-temperature coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.