Patent · US Expired

System for manufacturing semiconductor substrates

US5083364A · kind A · utility

57Cited by

8References

28Claims

0Family size

Assignee

Convac, Ltd. · DE

Inventors

Herbert Olbrich · Rutesheim, DE
Joseph Gentischer · Winnenden, DE
Wolfgang Fruhauf · Gerlingen, DE
Johann Dorner · Plochingen, DE
Gunther Breitschwerdt · Stuttgart, DE
Horst Kunze-Concewitz · Wiernsheim, DE
Wolfgang Schmutz · Rottweil, DE
Roland Mann · Stuttgart, DE

Key dates

Filing date	Mar 20, 1990
Grant date	Jan 28, 1992
Priority date	—
Expiry date	Mar 20, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5136
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system for manufacturing substrates, in particular wafers, glass masks, and channels, having individual process stations for treating and/or processing the various substrates in a clean environment. A plurality of interchangeable and aligned process modules are provided which are connected and disconnected from a media bus in which inflow and outflow lines are situated. These lines serve to supply the process modules through the noted connection with chemicals, gases, liquids, data and energy as needed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.