Patent · US Expired

Pour head seal assembly for a mold for forming composite articles

US5085568A · kind A · utility

8Cited by
6References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 25, 1991
Grant dateFeb 4, 1992
Priority date
Expiry dateFeb 25, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S425/047
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A pour head seal assembly for a mold including a mold cavity part and a lid, with a film layer against the inner surface of the lid and a preformed shell against the inner surface of the mold cavity part. The pour head seal assembly may be operatively mounted on either the lid or the mold cavity part, including a nozzle mounted through an opening formed in the selected element, with either the film layer or the preformed shell having an opening formed therein for mounting around the nozzle. A clamp plate collar is mounted on the inner end of the nozzle, adapted to clamp either the film layer or the preformed shell against an O-ring seal mounted on the adjacent inner lid or mold cavity surface to eliminate foam leakage around the nozzle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.