Method of bonding silicone elastomer to a substrate
US5085894A · kind A · utility
9Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1991 |
| Grant date | Feb 4, 1992 |
| Priority date | — |
| Expiry date | Jan 25, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31667
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of bonding a silicone elastomer to a substrate which comprises treating the surface of the substrate with a cleaning agent which is a polydiorganosiloxane, for example a polydimethylsiloxane, and thereafter applying to the treated surface a room temperture curing silicone elastomer-forming composition. The method finds particular application in the construction industry for the bonding of sealants to non-porous substrates such as aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.