Thermoplastic resin layer chemically bonded to thermoset resin layer
US5087514A · kind A · utility
55Cited by
29References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1989 |
| Grant date | Feb 11, 1992 |
| Priority date | — |
| Expiry date | Aug 30, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A polymeric resin laminate is manufactured by bonding the molecularly-modified, adhesion-improved surface of a rigid thermoplastic resin layer to a thermoset resin layer, advantageously, in a reaction injection molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.