Photosensitive resin composition
US5087552A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1989 |
| Grant date | Feb 11, 1992 |
| Priority date | — |
| Expiry date | Oct 13, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2810/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.