Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste
US5087658A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1989 |
| Grant date | Feb 11, 1992 |
| Priority date | — |
| Expiry date | Dec 18, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.