Cold plate for cooling electronics
US5088005A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 8, 1990 |
| Grant date | Feb 11, 1992 |
| Priority date | — |
| Expiry date | May 8, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed. A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling. The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.