Integrated circuit socket with reed-shaped leads
US5088930A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1990 |
| Grant date | Feb 18, 1992 |
| Priority date | — |
| Expiry date | Nov 20, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/912
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket has several upwardly extending resilient single-reed-shaped contacts that connect to downwardly extending portions of leads of an integrated circuit package. A bottom section supports these contacts and the leads of the socket, which are connected to the contacts. The contacts may be integral to lead frame elements, make a wiping contact over at least half of the downward section or at least 0.02 inches, extend from the bottom surface of the package, press inwardly or outwardly against the package leads, and are separated and maintained in registration by ribs. A top section with ribs separates and maintains the package leads in registration and a resilient reed retains the package in the top section. A pin-and-socket connector maintains the top section in place. The package leads are retained by a surface against the force applied by the contacts. The socket leads are pins supported by the bottom section and are connected to a lead frame element and the bottom section is made of a molded thermoplastic in which the elements are at least partially embedded. The socket leads and contacts are integral to the same lead frame elements and may be adapted for through-hole inserti…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.