Highly conductive polymer thick film compositions
US5089173A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1990 |
| Grant date | Feb 18, 1992 |
| Priority date | — |
| Expiry date | May 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2201/032
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermally curable conductive polymer thick film composition comprising, by weight: PA0 (a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin; PA0 (b) a second thermoplastic resin selected from the group consisting of: PA1 (i) about 1-6 parts of at least one thermoplastic polyurethane resin; PA1 (ii) about 2-10 parts of at least one thermoplastic polyester resin; or PA1 (iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin; PA0 (c) about 0.05-1 parts of a tertiary amine; PA0 (d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and PA0 (e) about 50-80 parts of silver flake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.