Process for producing ceramic film casting mixtures for thin-film circuits

US5089194A · kind A · utility

Assignee

• Hoechst Ceramtec AG · DE

Inventors

• Carl Hoffmann · Bodolz, DE
• Dieter Grote · Marktredwitz, DE

Key dates

• Filing date: May 25, 1990
• Grant date: Feb 18, 1992
• Expiry date: May 25, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/4807
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

To produce Al.sub.2 O.sub.3 -containing ceramic film casting mixtures for thin-film circuits, unground, calcined alumina with low primary particle size and high reactivity is ground, optionally together with a solvent mixture, then the binder or a mixture of a plurality of different binders and the plasticizer or a mixture of a plurality of different plasticizers are added and the mixture is ground again until the alumina reaches a particle size of 2-10 .mu.m. The alumina, optionally together with a sintering aid, may first be ground alone in the solvent or the solvent mixture for 24 to 72 hours. The sintering aid or sintering aids may also be first ground in the solvent or the solvent mixture and the alumina added to the suspension obtained.