High-sensitivity thermosensitive multilayer film and method for production of plate-making stencil sheet
US5089341A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1989 |
| Grant date | Feb 18, 1992 |
| Priority date | — |
| Expiry date | Jul 17, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to the high-sensitivity thermosensitive multilayer film and the method to produce plate-making paper using the film. In the present invention, the high-sensitivity thermosensitive multilayer film consists of at least one functional layer and at least one peeling layer. The said functional layer is made of the thermoplastic resin layer with the thickness of 0.1 to 12 .mu.m and with at least 30% of a thermal shrinkage rate and at least 50 g/mm.sup.2 of thermal shrinkage stress value. The peeling layer consists of the thermoplastic resin layer which is different from that of the functional layer and is the special multilayer film which is readily releasable and capable of exerting a compressive force to the functional layer. When the stencil sheet is manufactured by using the said multilayer film, the operation efficiency at time of lamination and the shrinkage capacity can improve by peeling the said peeling layer after lamination from porous supporting member. Moreover the resistance of the original paper to curling is remarkably enhanced under a high temperature circumstances by removing the compressive force working on the functional layer as result o…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.